Your last feedback is 4 weeks old, and so far I have received no further information. What is the current state?
- For the LMZ12002 we get the information that there are quality problems (weak interface between mold compound and flip chip die surface) and they will be fixed in Q2/2013. What is the current state for the fix in the LMZ12002 and the LMZ14202 series?
- Is our LMZ14202 without function and Datecode/Number on package 32ATJ9C3 or G3 affected from this quality problem?
- From what date code the problems are fixed in the LMZ12002 and the LMZ14202?
We must clear and solve these effect promptly; otherwise the LMZ14202 can’t be used in the series. We therefore appreciate your promptly feedback and are available for questions.
Best regards