Hello Kartik,
I watched the EVM you told before ark here and the thing that i couldnt understand is that it says:
The designer must consider carefully the thermal design of the PCB for optimal performance over
temperature. For this EVM, Figure 5 shows that the PCB top GND plane has six, 6-mil, thermal via
connections to the bottom-side copper GND plane to dissipate heat. The PCB is a two-layer board with
2-oz. copper on top and bottom layers.
But in the Figure 5: I only see black plane, so i dont know if truly is the THERMAL PAD connected to GND in Both sides (Top and Bottom) or just in the Bottom one or in the other one?
Thanks because your Help!
